Wire to Board Connectors

Forefront of Electronic Connectivity

Wire to Board Connectors: Box Headers, Wafers, Eject Headers, and IDC Headers

In the world of electronic connections, wire-to-board connectors are the bridge that allows signals and power to flow seamlessly between your devices and printed circuit boards (PCBs). FPIC presents a diverse range of high-quality wire-to-board connectors, including Box Headers, Wafers, Eject Headers, and IDC Headers.

Our Wire to Board Connectors:

Box Headers: Box Headers are robust connectors that play a pivotal role in securely linking wires or cables to a PCB. They come with a protective housing that safeguards the connection and provides additional stability.
Wafers: Wafers are compact, low-profile connectors, making them ideal for applications where space is limited. They provide a reliable connection, often used in consumer electronics and other compact devices.
Eject Headers: Eject Headers, known for their “push-to-eject” design, enable easy insertion and removal of a mating connector. This user-friendly feature is valuable in applications that require quick and secure connections.
IDC Headers: Insulation Displacement Contact (IDC) Headers create dependable and robust wire connections without the need for stripping insulation. These connectors are commonly used in various applications for their efficiency.
DIP Headers: Dual In-line Package (DIP) Header Connector is an integral component designed for precise and adaptable connections on Printed Circuit Boards (PCBs).

Applications:

Consumer Electronics: Wire-to-board connectors are widely used in consumer devices, including televisions, gaming consoles, and home appliances.
Automotive Electronics: In vehicles, these connectors are essential for powering infotainment systems, sensors, and various control modules.
Industrial Equipment: Wire-to-board connectors are found in industrial automation and machinery, contributing to the seamless operation of production lines.
Telecommunications: These connectors play a crucial role in networking and telecommunications equipment, ensuring reliable data transmission.
Custom Projects: FPIC’s customization capabilities make our connectors suitable for a wide range of specialized applications, including aerospace, medical devices, and more.

Wafer Box Header Eject Header IDC Header DIP Header

FPIC’s commitment to quality, precision, and customization makes our wire-to-board connectors a trusted choice. Our Box Headers, Wafers, Eject Headers, IDC and DIP Headers are designed to support your electronic designs, ensuring reliable connections and efficient performance.

Contact FPIC here or send email to [email protected].