Specifications

Current Rating1.0AMP
Insulation Resistance500MΩ  MIN.
Contact Resistance20mΩ MAX.
Withstanding voltageAC500V Min.
Operating Temperature-25°C to +85°C
Contact MaterialBrass
Contact PlatingGold or Tin over Nickel
Insulation MaterialHigh Temperature Thermoplastic, UL 94V-0
ColorWhite

1.50mm Wafer SMT Type–AWP001Q-001

Features:

  • Space-Saving Design: The 1.50mm pitch ensures a compact form factor, making it ideal for applications with limited space.
  • SMT Compatibility: Designed for surface-mount technology (SMT) assembly, ensuring ease of integration into your PCB designs.
  • Secure Connections: The straight wafer design ensures a secure and reliable connection, critical for uninterrupted device performance.
  • Durable Construction: Crafted from robust materials, this wafer is built to withstand the rigors of various environments.
  • Versatile Applications: 1.50mm smt type wafer is suitable for a wide range of electronic devices and circuits, including consumer electronics, automotive systems, and industrial equipment.

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