Specifications

Current Rating 2.0AMP
Insulation Resistance 1000MΩ  MIN.
Contact Resistance 20mΩ MAX.
Withstanding voltage AC 500V Min.
Operating Temperature -25°C to +85°C
Contact Material Brass
Contact Plating Gold or Tin over Nickel
Insulation Material High Temperature Thermoplastic, UL 94V-0
Color White

2.00mm Wafer DIP Type–AWE001S-002

Features:

  • 2.00mm Pitch: This wafer features a 2.00mm pitch, making it suitable for applications where space is limited while maintaining robust connections.
  • Straight DIP Configuration: Designed for through-hole mounting in a straight configuration, ensuring compatibility with various PCB layouts.
  • Exceptional Versatility: Ideal for use in a wide range of electronic devices, from consumer electronics to industrial equipment.
  • Durable Build: Constructed from high-quality materials, this 2.00mm wafer connector is engineered to withstand challenging environmental conditions, providing longevity and stability.
  • Reliable Connectivity: Precisely crafted to deliver secure and uninterrupted electrical connections.

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