Current Rating 2.0AMP
Insulation Resistance 1000MΩ  MIN.
Contact Resistance 20mΩ MAX.
Withstanding voltage AC 500V Min.
Operating Temperature -25°C to +85°C
Contact Material Brass
Contact Plating Gold or Tin over Nickel
Insulation Material High Temperature Thermoplastic, UL 94V-0
Color White

2.00mm Wafer DIP Type–AWE001R-001


  • Compact Design: With a 2.00mm pitch, this wafer offers a space-saving solution, making it ideal for applications with limited PCB real estate.
  • Right Angle Wafer Configuration: Designed for through-hole mounting at a right angle, ensuring secure connections and ease of assembly in tight spaces.
  • Versatile Use: Suitable for various electronic devices and circuits, including those in consumer electronics, automotive systems, and industrial equipment.
  • Durable Construction: Crafted from high-quality materials, this wafer is built to withstand challenging environmental conditions, ensuring long-lasting performance.
  • Reliable Connectivity: Precisely engineered to provide secure and uninterrupted electrical connections.

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